Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t.

So, I installed the latest BIOS (dont know if that mattered, but at least the beta BIOS is not broken).Assuming your chips are the same kind of Samsung as mine (based on version) it may exhibit similar properties to mine. I am waiting to see what happens with the new AMD (Ryzen 2?) hardware to be released - I think it's this month or next month. The clever and stylish, low-profile design of DDR4 LPX memory means it can fit comfortably into much smaller spaces. The LPX series of Vengeance DRAM was prepared for when the first of the Micro ATX and Mini-ITX motherboards for DDR4 memory released. In any system that has minimal internal space the small form factor of the LPX DDR4 RAM from Corsair is ideal. reboot. memtest86. if all good then boot into windows and get your memory settings from Ryzen Master. I am very sorry for my post being so long and please excuse me if my English is not perfect, but it's not my native language.

I don't know. I haven't been able to confirm what that version really "is" from anywhere. I suspect it's just lower grade b-die. In particular this is a good way to get what your motherboard decides to use by default for termination, cad bus, and misc values. This provides a base point where you know what values already work.

Compatibility tested

If your problem is you can't get your XMP kit to run at XMP frequency then start with JEDEC speeds first (2133 to 2666) with XMP DRAM voltage. For RAM constrained applications, look into more scientific applications. Also worthwhile would be X99 in dual channel vs X99 in quad channel. The DDR4 form factor is optimized for the latest AMD and Intel DDR4 motherboards and offers higher frequencies, greater bandwidth, and lower power consumption than DDR3 modules. Vengeance LPX DDR4 modules are compatibility-tested across AMD and Intel DDR4 motherboards for reliably fast performance. said:What was the system build used for the testing? Is it me or it's missing from the article?it seems that part of the article got "cleaned" :)

It's a theory that may seems reasonable but I cannot confirm for sure in any way and would be interesting to understand the difference. Generally I've had good results when enabling GearDown and disabling PowerDown with both my LPX and RGB kits and Zen+ and Zen2 CPU's. Keeping DRAM voltage near 1.35v seemed to be a sweet spot as using higher voltages didn't seem to have any improving effects for my RGB kit and keeping SOC between 1.0v and 1.1v.I may consider moving over to the Z version if that's a better option. I know people have really good results getting higher speeds and tighter timings with the Samsung B-die Z version so I'm not sure why the B version I have has different specs if it's the same memory module on there. It may be that the CMK16GX4M2B3200C16 (Optimized for Intel) is using the less expensive and worse hynix chips (they have problems with AM4 but works good with Intel) while Glad to report that the system did POST and everything seems to be working smoothly. Did some mem testing for around 10 minutes and it didnt crash, so I guess the pc is usable for now. I will stress test and benchmark tomorrow, too tired now. Klarna Bank AB (publ) is Authorised by the Swedish Financial Services Authority (Finansinspektionen) and is subject to limited regulation by the Financial Conduct Authority.

The CMK16GX4M2B3200C16 seems to be optimized for Intel boards. It runs at a slightly higher voltage than the CMK16GX4M2Z3200C16 and supports XMP 2.0. The CMK16GX4M2Z3200C16 appears to be optimized for Ryzen.

Built-in heat spreaders

As you step up in frequency and you can't seem to get DRAM Calculator values to work you can revert to what did work (from the previous step) starting with ProcODT, RTT, and CAD values. The thing is, I think the B version I have is Samsung though it doesn't specify B die. The Manufacturer says Samsung and it just says 8gb/1 die but I'm assuming that's a Samsung B Die.